What are the performance requirements of sputtering targets?

I believe everyone is familiar with sputtering targets. It is mainly used in chips, microelectronics, display screens and other industries. Especially with the development of the electronic information industry, the demand for sputtering targets has gradually increased. The material is also known by more people, so what are the requirements for the performance of the sputtering target during use? The following editor will introduce to you the performance requirements of sputtering targets.

Performance requirements for sputtering targets

1. Purity

Purity is the main performance index of the Ti-Al Sputtering Target. The purity of the sputtering target has a great influence on the performance of the thin film. However, in the actual application process, different products have different requirements for the purity of the target. For example, in the microelectronics industry, with the development of the industry, the size of silicon wafers has been developed, and the width of wiring has been reduced from 0.5um to 0.25um, 0.18um or even 0.13um. The purity of the previous target can be satisfied. The process requirements of 0.35um IC, but the purity of the target material before the preparation of 0.18um lines is not competent, and the purity needs to be higher.

2. Impurity content

Impurities in sputtering targets and oxygen and moisture in pores are the main sources of pollution for target deposition films. Targets with different uses have different requirements for impurity content. Pure aluminum and aluminum alloy targets used in the semiconductor industry have certain special requirements for alkali metal content and radioactive elements.

3. Density

In order to reduce the number of pores in the sputtering target and improve the performance of the sputtering film, the density of the sputtering target also has certain requirements. Because the density of the sputtering target affects the amount of sputtering of the target, it also affects the electrical and optical properties of the film. The higher the density of the target, the better the performance of the film. Not only that, improving the density and strength of the target can also help the target to better withstand the thermal stress during the sputtering process, so the density is also one of the important performance indicators of the sputtering target.

4. Crystal Orientation

 The sputtering target is suitable for sputtering. The atoms of the target are easily sputtered along the relatively close arrangement of the atoms in the hexagonal direction. Therefore, in order to improve the sputtering speed of the target, it is necessary to increase the sputtering by changing the crystal structure of the target. speed. Different materials have different crystal structures, so different forming methods, heat treatment methods and conditions are required to improve the sputtering efficiency of the target and ensure the quality of the deposited films.