Analysis of application requirements of titanium and titanium alloy materials in civil, aerospace and manufacturing industries

Target application:

The phenomenon that energetic particles (such as argon ions) bombard the solid surface, causing various particles on the surface, such as atoms, molecules or clusters, to escape from the surface of the object is called "sputtering." In magnetron sputtering coating, the positive ions generated by argon ionization are usually used to bombard the solid (target), and the sputtered neutral atoms are deposited on the substrate (workpiece) to form a film. The magnetron sputtering coating has a " Two characteristics: low temperature and fast speed.

Principle of magnetron sputtering:

Add an orthogonal magnetic field and electric field between the sputtered target (cathode) and the anode, and fill the required inert gas (usually Ar gas) in the high vacuum chamber. The permanent magnet forms 250-350 on the surface of the target material The Gaussian magnetic field forms an orthogonal electromagnetic field with the high-voltage electric field.

Under the action of an electric field, Ar gas ionizes into positive ions and electrons, and a certain negative high voltage is applied to the target. The electrons emitted from the target are affected by the magnetic field and the ionization probability of the working gas increases. A high-density plasma is formed near the cathode, and Ar ions are accelerated to the target surface under the action of the Lorentz force, and bombard the target surface at a high speed, so that the atoms sputtered out of the target follow the principle of momentum conversion. The high kinetic energy departs from the target surface and flies toward the substrate to deposit a film.

Magnetron sputtering is generally divided into two types: DC sputtering and radio frequency sputtering. Among them, the principle of DC sputtering equipment is simple, and its rate is also fast when sputtering metal. The application range of radio frequency sputtering is more extensive. In addition to sputtering conductive materials, non-conductive materials can also be sputtered. At the same time, reactive sputtering can be used to prepare compound materials such as oxides, nitrides, and carbides. If the frequency of radio frequency increases, it becomes microwave plasma sputtering. Nowadays, electron cyclotron resonance (ECR) type microwave plasma sputtering is commonly used.
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