Sputtering targets, also known as sputtering targets, are one of the main materials used in thin film fabrication. Although not as well-known as photoresist, they are indispensable materials in chip manufacturing, and the quality of the target affects the performance of the finished chip. So, in which industries are sputtering targets currently used? Many people are curious about this, so the following will introduce the uses and structure of sputtering targets. Tantalum Sputtering Target
I. Uses of Sputtering Targets
1. Used in Displays
Sputtering targets are currently widely used in flat panel displays (FPDs). In recent years, the application rate of FPDs in the market has been increasing year by year, which has also driven the technology and market demand for ITO sputtering targets. There are two types of ITO sputtering targets: one uses indium tin alloy targets, and the other uses a mixture of nano-sized indium oxide and tin oxide powder sintered together.
2. Used in Microelectronics
Sputtering targets are also used in the semiconductor industry. Relatively speaking, the semiconductor industry has more stringent requirements for the quality of sputtered thin films. 12-inch (300mm) silicon wafers are now being manufactured, but the width of interconnects is decreasing. Currently, silicon wafer manufacturers require target materials to be large in size, high in purity, low in segregation, and fine in grain size, placing high demands on their quality. This necessitates target materials with superior microstructures.
3. Applications in Storage Technology
The storage technology industry has a large demand for target materials. The development of high-density, high-capacity hard drives relies heavily on giant magnetoresistive (GMR) thin-film materials. CoF~Cu multilayer composite films are currently widely used GMR thin-film structures. TbFeCo alloy target materials for magneto-optical disks are still under development; magneto-optical disks manufactured using these materials have long lifespans, large storage capacities, and can be repeatedly erased and rewritten without contact.
II. Structural Composition of Target Materials
1. Target Blank
The target blank is the core component of the target material. It is the target material bombarded by the high-speed ion beam and involves high-purity metals and grain orientation control. During sputtering deposition, the target blank is bombarded by ions, causing its surface atoms to be sputtered and deposited onto the substrate to form an electronic thin film.
2. Backplate
The backplate is mainly used to fix the sputtering target material, involving welding processes. Because high-purity metals have relatively low strength, and sputtering targets need to be installed in a specialized machine for the sputtering process, the machine provides a high-voltage, high-vacuum environment. Therefore, the ultra-high-purity metal sputtering target blank needs to be bonded to the backplate using different welding processes. Consequently, the backplate also needs to have good thermal and electrical conductivity.
